Semiconductor Summit 2026

Registration & Networking

Welcome Remarks

KEYNOTE: Heterogeneous Integration and the Role of Hardware in Advancing AI

Timothy Lee • Boeing Technical Fellow and 2025 IEEE USA President

This talk will provide insight into how cutting-edge research into increasing semiconductor performance led by the industry is driving the future of AI development. For students, this is a unique opportunity to hear how classroom fundamentals translate into cutting-edge technology and real impact, and how hardware innovation continues to define what's possible in AI.

Designing for Manufacturability: Bridging the Two Halves of the Chipmaking Process

Dr. Jason Cain • AMD - Fellow Silicon Design Engineer

Explore how design works in conjunction with manufacturing practices in order to achieve the maximum output of viable chips in the fabrication pipeline.

Break

KEYNOTE: Semiconductor Fabrication & Advances in the Recent Past

Dr. Chanaka Munasinghe • Intel - University Programs Director

This talk will explore how modern fabrication technologies are evolving, what innovations are shaping the future of semiconductor manufacturing, and how students and researchers can engage with these rapidly advancing fields.

Speaker: Cadence

Session details to be announced.

Break

KEYNOTE: Scaling AI Beyond Moore's Law: SerDes, 3D-IC Interconnects, Silicon Photonics, and DTCO for the Next Generation of Computing

Dr. Victor Li • TSMC - Director of SerDes, 3D-IC Interconnect, and DTCO

This talk will provide an inside look at how the world's most advanced semiconductor systems are being designed, optimized, and scaled in industry — and what this means for the next era of AI hardware. With TSMC at the heart of the global semiconductor ecosystem, Dr. Shenggao Li's work directly contributes to the cutting-edge manufacturing and advanced packaging technologies that are powering the world's AI compute revolution — from data centers to next-generation accelerators. For students, this is a rare opportunity to learn directly from a leader shaping real production silicon. For industry, it highlights the technical depth and impact driving this year's Summit.

Lunch & Networking

Enjoy lunch, explore the exhibition hall, and network!

Breakout Sessions

Be sure to register for TI, Infineon, Arm, or Cadence's breakout sessions!

Different Pathways in the Semiconductor Industry

Panelists: Imagibob, Texas Instruments, SwRI, Keysight, and Arm

Break

The AI-Augmented Engineer: How the Role of Hardware Engineers is Changing

Susan Graham • Arm - Technical Director & Senior Principal Engineer

Edge AI: Markets & Innovation

Gregory Guez & Sarah Hemmer • Infineon - Senior Director, Global Head of IoT and Edge AI Solutions Marketing & Imagibob - CEO

Session details to be announced.

Break

KEYNOTE: Accelerating AI Through Physical Design at Scale

Rashmi Chatty • Marvell - Distinguished Engineer

As AI systems scale, performance is increasingly limited not by algorithms or RTL, but by the physical realities of wires, power delivery, clocking, and layout. This talk examines how AI acceleration has shifted from a compute‑centric problem to a system‑level physical design challenge, drawing on lessons from large‑scale, multi‑chip AI implementations. Through a physical‑design lens, it shows how floorplanning, interconnect, power, and clocking decisions ultimately determine which AI architectures can be built, and which never make it to silicon.

IEEE USA & IEEE UPP

Learn more about IEEE initiatives

Closing Remarks, Prize Announcement, & Networking Reception

Join us for the closing remarks and be sure to stay for our networking reception!